|
TCM1 Tactical Computing Module
Key Features
Ultra compact rugged design
Height: 3” (7.62cm)
Width: 11” (28cm)
Depth: 12.75” (32.4cm)
Weight: 12lbs (5.5Kg)
High performance Intel Core 2 Duo Mobile 2.53GHz CPU w/1066MHz FSB, 8GB DDR3, Intel GM45 and ICH9-M chipsets
PC industry standard connectors (excluding PWR)
Optimized for vehicular or UAV applications requiring powerful processing and high volume I/O
1XSD socket, 1Xmini PCI and 1Xmini PCIe
External Ports - 2XPS2, 2XGBLAN, 1XVGA, 6XUSB, 1X1394, 1XRS232, 1XSPDIF and 7.1 channel audio
Configuration Management available upon request; designed for long-life through Intel® Roadmap partnership
Mounting options include fixed mount or vibration isolated
Rugged Series Structural Features
All aluminum construction
6061 Hardened structural aircraft aluminum
MIL-C-5541E Class 3 chem film protection or optional MIL-C-26074E Class 3,
Grade A, or CARC / powder coated options for finish
Built to survive shock and vibe
Passed MIL-STD-810G shock & vibe testing
Multiple attachment points on motherboard and CPU heatsink stabilize PWB
All fasteners and connectors retained with locking mechanisms
Cabling dressed and secured to prevent chafing
Superior Cooling and EMI Performance
Cooling
High speed, high volume fans offer maximum airflow and are designed for long life
Custom cabling reduces internal pressure drop to increase airflow
Conduction and convection cooling techniques optimized throughout
EMI/EMC
Passed EMC, MIL-STD-461F, CE102 and RE102 testing with significant margin
Input power filtering for MIL-STD-461, 704F, 1275 compliance
Finish applied maintains superior EMI/EMC characteristics throughout life of the unit
Superior grounding paths eliminate GND loops
| Military Standards |
Operational Temperature, MIL-STD-810F, Method 501.5,
Procedure I/II
Storage, MIL-STD-810F, Method 501.5, Procedure I/II
Humidity, MIL-STD-810F, Method 507.4*
Altitude, MIL-STD-810F, Method 500.4*
Vibration, MIL-STD-810G, Method 514.6, Procedure I
Shock, MIL-STD-810G, Method 516.6, Procedure I
EMC, MIL-STD-461F, CE102 (conducted) & RE102 (radiated) emissions |
-20°C to +65°C -- See Cooling options below
-40°C with Solid State Hard Drive (SSHDD)
-55°C to 85°C
48 Hour, 95% RH 40-65C, with Humidity kit
12,500ft operation, 40,000ft transport
7.18 GRMS, 5-2000Hz, 60 min/axis— w/SSHDD
20g, 11msec—functional shock; 40g, 11msec crash hazard shock
Passed with significant margin
|
| Mechanical |
Height
Depth
Width
Weight
|
3” (7.62cm)
11” (28cm)
12.75” (32.4cm)
12 lbs (5.5 kg) (does not include vibration isolators) |
| CPU |
|
Intel® CPU Architecture
|
2.53GHz Intel Core 2 Duo, Penryn socket P, Micro-FCPGA478 w/ 8GB DDR3 RAM, 3.06GHz CPU available temporarily
|
| Expansion Slots (1) |
|
Option 1
|
mini PCIe slot, 1XSD socket, 1 mini PCI slot |
| External Bays (1) |
|
Option 1 (std)
|
One or two SATA 2.5” HDD, rotational or SSHDD |
| Cooling |
|
Option 1 (std)
Option 2
|
Low speed, low volume fans 55oC operation with 54dB audible noise
High speed, high volume fans 65oC operation with 72dB audible noise
|
| Mounting Options |
|
Option 1 (std)
|
Fixed mount |
| Power Supply Options |
|
Option 1 (std)
|
10-32VDC with MIL-STD-461 filtering, MIL-STD-704F, 1275 |
| System Board |
|
Option 1
|
Supports Intel Penryn CPU with DDRIII SO-DIMM 667/800/1066 FSB,
dual GB-LAN 82573L, Mini PCI, Mini PCIe Card, IEEE1394, 2xSerial ATAII,
Realtek ALC888 7.1 Channel HD Audio, SPDIF and SD.
ACPI 2.0 power management
|
| * Crystal Group designs all servers to meet or exceed the specifications listed herein. Due to the sheer number of models and combinations of components (memory, CPU, peripheral cards, hard drives), it is not practical to test every combination of servers offered. Please ask your Crystal Business Development Manager for data on qualification testing for configurations similar to the desired configuration for your application |
|
|
| Do you need to talk to someone directly? Enter your phone number and we will call you to answer any questions |
|
|