ES232S19 Rugged Embedded Computer

Field-tested, fail-safe and lasting performance in extreme conditions. Crystal Group ES™ – Energy Series – delivers rugged solutions, powered by Intel®, to ensure long lasting, high performance in the most extreme, remote, unpredictable conditions. This includes our rugged, powerful and compact embedded computers. Completely and easily configurable, the ES product line boasts advanced thermal management and an all-aluminum chassis, field-tested to withstand electrical surge, airborne contaminants and humidity in harsh environments. Crystal Group embedded computer systems follow the Intel embedded roadmap to ensure access to the latest in long life, powerful Intel chipsets and processors.

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ES232S19 - Spec Sheet

Features

ES232S19 Rugged Embedded Computer

• Compact construction – 2U H x 19” x 19” footprint
• Standard 19″ rack mounting options
• Up to eight core Intel® Xeon® D CPUs
• Up to six 2.5″ SSD hard drives
• Billet construction from milled and strain hardened 6061-T6511 structural aircraft aluminum
• IEEE 1613 and IEC 61850-3 certification ready
• Fanless; no moving parts drives higher reliability

Please contact us to receive the reports, guides and drawings that best fit your requirements.

Specifications

Environmental Standards
Operational temperature

-40°C to +40°C

Storage temperature

-40°C to +85°C

Humidity

95% non-condensing with humidity kit

Altitude

12,500ft operation, 40,000ft transport

Vibration

5.5G, 10-2000Hz, 60 min/axis, 3 axis

Shock

20g, 11msec– functional shock; 40g, 11msec crash hazard shock

Electromagnetic Compatibility Standards
Some standards may require an internal kit
IEC 61850-3

International Standard Communication Networks and Systems for Power Utility Automation (covers environment and EMC concerns)

IEEE 1613

Standard Environmental and Testing Requirements for Communications Networking Devices in Electric Power Substations

Emissions

Radiated FCC Part 15. 109, Class A; conducted FCC Part 15. 107, Class A

Testing with solid state drives
Mechanical
Form Factor
2U
Height
3.5" (8.89cm)
Width
19" (48.26cm)
Depth
19" (48.26cm)
Weight:
30 - 40 lbs ( 13.61 - 18.14 kgs )
Power
150-200W with select configurations, CPU dependent
Expansion Slots
Two PCIe x16 low profile, one PCIe x16 full height
External Bays
Up to six 2.5” SSDs or four 2.5" NVMe SSDs
Cooling

Fanless; passive cooling through heatpipe technology with no moving components

Mounting
19” rack mount kit
Power Supply
Option 1

Dual, redundant, 90-250 VAC + 125 VDC

Option 2

Dual, redundant, 125 VAC + 125 VDC

System Board
Option 1

X10SDV-7TP4F, 8 core Xeon D-1537 CPU, up to 128 GB ECC DDR4, 2 USB 2.0, 2 GBLAN, 2 SFP+, IPMI, VGA, 1-PCIe x16

Option 2

X10SDV-TP8F, 4 core Xeon D-1518 CPU, up to 128 GB ECC DDR4, 2 USB 2.0, 6 GBLAN, 2 SFP+, IPMI, VGA, 1PCIe x16

Software Compatibility
Accepts Windows 10®, RHEL®, VMware 6® or Windows Server 2019®
Export Compliance
ECCN: 5A992 | Classification is dependent on configuration and is subject to change. Please contact your Program Manager to receive the classification of your product.