RE1014 Rugged Embedded Workstation

Field tested, failsafe and long life performance in extreme conditions. Feature rich Crystal Group Embedded Computer Systems are powerful, compact, and rugged. Completely and easily configurable, the Embedded product line boasts advanced thermal management and an all-aluminum chassis, are
field-tested to withstand shock and vibration, extended temperature ranges, harsh elements and harsh environments. Crystal Group Embedded Computer Systems follow the Intel® Roadmap to ensure access to the latest, powerful Intel chipsets and processors.


RE1014 Rugged Embedded Computer

• Compact construction – 2.4”H x 16.5” x 11” footprint
• Panel or rack mounting options
• Power dual and Quad Core i7® CPU options
• Up to four (4) SSD hard drives
• Billet construction from milled and strain hardened 6061T651 structural aircraft aluminum
• IEEE 1613 and IEC 61850-3 certified


Environmental Standards
MIL-STD-810, Operational Temperature

-40°C to +60°C

MIL-STD-810, Storage, Method 501, Procedure I/II

-40°C to +85°C

MIL-STD-810, Humidity, Method 507, Procedure II

240 hours with humidity kit

MIL-STD-810, Altitude, Method 500

12,500ft operation, 40,000ft transport

MIL-STD-810, Vibration, Method 514, Procedure I

5.5G, 10-2000Hz, 60 min/axis, 3 axes

Electromagnetic Compatibility Standards
Some standards may require an internal kit
IEC 61850-3

International Standard Communication Networks and Systems for Power Utility Automation (covers environment and EMC concerns)

IEEE 1613

Standard Environmental and Testing Requirements for Communications Networking Devices in Electric Power Substations


radiated FCC Part 15. 109, Class A; conducted FCC Part 15. 107, Class A

Testing with solid state drives
2.4" (6.1cm)
16.5" (41.91cm)
11" (27.94cm)
7.52 lbs ( 3.41 kgs ) Power: 55-80W with select configurations, CPU dependent
Expansion Slots
One PCIe X16 low profile
Internal Expansion Slots
Up to four SATA 2.5” SSD (not externally removable)
Removable Drives and I/O
Up to four SATA 2.5” SSD (not externally removable)

Fanless; passively cooled through heatpipe technology with no moving components

Option 1

Panel mounting via ears on base

Option 2

19″ rack mount kit

Power Supply
Option 1

90-250 VAC 50/60Hz with locking power cord

Option 2

18-36 VDC

Option 3

48 VDC

Option 4

130 VDC

System Board
(Note, these features are at the board level and may not all be available in the standard configuration)
Option 1

X9SPV-LN4F-3LE, FCBGA1023, i7-3555LE CPU, 2-16 GB ECC DDR3, 4-USB 2.0,
4-GBLAN, On-board SATA2 & SATA3

Option 2

X9SPV-LN4F-3QE, FCBGA1023, i7-3612QE CPU 2-16 GB ECC DDR3, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Software Compatibility
Accepts Windows 10®, RHEL 5®, VMware 5.5® or RHEL 6®
Export Compliance
ECCN: 5A992 | Classification is dependent on configuration and is subject to change. Please contact your Business Development Manager to receive the classification of your product.

Reports, Guides & Drawings

RE1014 Embedded Computer- Outline Installation Drawing
TST-00195 RE1014 MIL-STD-810 In House Thermal Test Report