Field-tested, failsafe and long-life performance in extreme conditions. Crystal Group rugged thin and zero clients bring plug-and-play functionality to demanding military and industrial applications in air, on land, and at sea. Maximum network bandwidth virtualization through client-side caching provides superior performance with dual video HD outputs and high-end graphics capabilities all in a small, rugged package. Non-volatile memory provides an “unplug and abandon” capability with a design to survive extreme environments, extreme temperatures, and high shock and vibration.
Thin Clients
- Quad core AMD GX-420GL, Intel Pentium or Celeron CPU
- Up to 3080×2160 supported resolution
- GB Ethernet and USB 3.0
- Rugged shock and vibration resilient design
- Compact footprint integrates easily in tight spaces
Environmental Standards
| MIL-STD-810, Operational Temperature, Method 501/502 Procedure I/II | -40°C to +71°C |
| MIL-STD-810, Storage, Method 501, Procedure I/II | -40°C to +85°C |
| MIL-STD-810, Humidity, Method 507, Procedure II | 240 hours with humidity kit |
| MIL-STD-810, Altitude, Method 500 | 12,500ft operation, 40,000ft transport |
| MIL-STD-810, Vibration, Method 514, Procedure I | 4.63GRMS, 5-2,000Hz, 60 min/axis with solid state drives and vibration kits |
| MIL-S-901, Grade B | With shock kits |
Electromagnetic Compatibility Standards
| FCC Class A |
Mechanical
| RTC5070 | |
| Height | 1.92" |
| Width | 7.75" |
| Depth | 7.62" or 8.87" with rear bracket |
| Weight | 3.3 lbs (1.5 kgs) |
| RTC5070+ | |
| Height | 3.61" |
| Width | 5.875" |
| Depth | 7.45" |
| Weight | Less than 8 lbs |
| HD PC+ | |
| Height | 1.70" |
| Width | 7.45" |
| Depth | 6.00" |
| Weight | 3 lbs |
CPU
| RTC5070 | Celeron Quad Core 1.5/2.5, Pentium Quad Core 1.5/2.8 |
| RTC5070+ | Pentium Quad Core 1.5/2.8 |
| HD PC+ | AMD GX-420GL |
Memory
| RTC5070 | 4-8 GB RAM |
| RTC5070+ | 8 GB RAM |
| HD PC+ | 4-16 GB RAM |
Storage
| RTC5070 | 16-256 GB SSD |
| RTC5070+ | 16 GB EMMC |
| HD PC+ | 32-128 GB SSD |
I/O
| RTC5070 | 2 or 3 Display port; USB 3.0 - 4x rear, 1x front; USB 3.1 Type C - 1x front; USB 2.0 - 2x front; Gigabit LAN interface, SFP option available; Audio In/Out |
| RTC5070+ | 3 Display port; AMD Radeon GPU; USB 3.0 - 4x rear, 1x front; USB 3.1 Type C - 1x front; USB 2.0 - 2x front; Gigabit LAN interface, SFP option available; Audio In/Out |
| HD PC+ | 1 Display port; 4 USB 2.0; 2 USB 3.0; Fiber SFP Port; Audio In/Out |
Cooling
| All models | Forced air convection via internal high reliability fan |
Mounting
| RTC5070 | 4 pt |
| RTC5070+ | 4 pt |
| HD PC+ | Option 1: 4 pt; Option 2: Single rack mount kit; Option 3: Dual (side by side) rack mount kit |
Power Supply
| RTC5070 | Option 1: 19VDC input to device; Option 2: 120/240V AC to DC external PSU (Power Brick) |
| RTC5070+ | 18-36 VDC DC, EMC compliant to MIL-STD-461, CE102, RE102 |
| HD PC+ | Option 1: 12VDC input to device; Option 2: 120/240V AC to DC external PSU (Power Brick) |
OS
| RTC5070 | Windows 10®, ThinOS |
| RTC5070+ | Windows 10®, ThinOS |
| HD PC+ | Thinx OS Linux |
Virtualization Platform Compatibility
| RTC5070 | Windows® Hyper-V, VMware® ESXi, Citrix® |
| RTC5070+ | Windows® Hyper-V, VMware® ESXi, Citrix® |
| HD PC+ | VMWare View Microsoft Remote FX |