More GPU power in a small package. Easily configurable to meet specific customer needs, the RE1312 boasts advanced thermal management in a lightweight, carbon fiber chassis field-tested to withstand shock and vibration, extended temperature ranges, and harsh environments. The RE1312 is powered by a mini-ITX motherboard, making it an ideal compute system for small, air-cooled applications that do not require a lot of I/O.
RE1312 Rugged Embedded Computer
- Light weight composite construction – 4.5”H x 12” W x 9”D footprint (7-8 lbs)
- Intel® Xeon® D and Core i7 CPU options
- 18-36 VDC power
- Up to 64GB unbuffered, non ECC DDR4 1.2V SO-DIMM
- Two 15mm SSD or three 7mm SSD storage options, removable drives
Mechanical
| Height | 4.5" (11.43cm) |
| Width | 12" (30.48cm) |
| Depth | 9" (22.86cm) excluding connectors |
| Weight | 7.52 lbs ( 3.41 kgs ) |
| Power | 55-80W with select configurations, CPU dependent |
CPU Architecture
| Intel® Xeon® D and Core i7 CPU options |
Expansion Slots
| One PCIe 3.0x16 low profile expansion bay |
Cooling
| Three high reliability 60mm fans |
Internal Expansion Slots
| Up to three SATA 2.5” SSD (externally removable) |
Memory
| Memory Up to 64GB unbuffered, non ECC DDR4 1.2V SO-DIMM or 128GB ECC DDR4 with Xeon D |
Power Supply
| 18-36 VDC |
Mounting
| Tray or bulkhead mounted using ears supplied |
Software Capability
| Windows® 10, RHEL® 6.6/6.7/7/7.1, SUSE SLES® 11, Ubuntu® 16, or Centos® 7.1 VMware® |
Environmental Standards
| MIL-STD-810, Operational Temperature | -40°C to +60°C |
| MIL-STD-810, Storage, Method 501, Procedure I/II | -40°C to +85°C |
| MIL-STD-810, Humidity, Method 507, Procedure II | 240 hours with humidity kit |
| MIL-STD-810, Altitude, Method 500 | 12,500ft operation, 40,000ft transport |
| MIL-STD-810, Vibration, Method 514, Procedure I | 5.5GRMS, 5-2,000Hz, 60 min/axis, 3 axes with vibration kit |
Electromagnetic Compatibility Standards
| Some standards may require an internal kit | |
| MIL-STD-461, CE102, RE102 |