MIL-STD-810 Test Method 501, High Temperature

MIL-STD 810 Test Method 501 –
High Temperature

Quick look:

  • Tests high temperature operation
  • In electronics, tests for circuit board stability
  • Two available test procedures: Storage and operation



About MIL-STD-810 Method 501

The purpose of this testing is to look for circuit board stability, making sure the electronics are operating in a stable manner and the CPU isn’t throttling or starting to inject wait states into the process.

At high temperatures, you want to look at:

  • Are the chipsets for the circuit board working correctly?
  • Are the magnetics in the power supply starting to suffer some loss of capability because of hysteresis?
  • Is there any deterioration of bonded surfaces?
  • Is there anything that would impact the short- or long-term function of the product?

At Crystal Group, we aim to be substantially below the maximum limit for the temperatures so we can ensure the product has a long life. Ultimately, it’s not just about the immediate performance, whether or not the CPU is working, but whether the product will last a long time in that environment. We want to keep components cool in the operation of the unit over its lifetime.

We find it’s best to set a more extreme limit, which is typically 55 to -40 degrees, and test our products to those limits for consistency.

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