RE0813 Rugged Embedded Computer

Field tested, failsafe and long life performance in extreme conditions. Feature rich Crystal Group Embedded Computer Systems are powerful, compact, and rugged. Completely and easily configurable, the Embedded product line boasts advanced thermal management and an all-aluminum chassis, are
field-tested to withstand shock and vibration, extended temperature ranges, harsh elements and harsh environments. Crystal Group Embedded Computer Systems follow the Intel® Roadmap to ensure access to the latest, powerful Intel chipsets and processors.

Features

RE0813 Rugged Embedded Computer

• Compact construction – 1.7” x 11” x 16.5” footprint
• Panel or rack mounting options
• Power efficient Intel Core i3® and Intel Core i7® options
• Up to three (3) SSD hard drives
• Billet construction from milled and strain hardened 6061T651 structural aircraft aluminum
• Redundant, extended temperature internal cooling fans

Specifications

Environmental Standards
MIL-STD-810, Operational Temperature

-40°C to +70°C, +85°C with select configurations

MIL-STD-810, Storage, Method 501, Procedure I/II

-40°C to +85°C

MIL-STD-810, Humidity, Method 507, Procedure II

240 hours with humidity kit

MIL-STD-810, Altitude, Method 500

12,500ft operation, 40,000ft transport

MIL-STD-810, Vibration, Method 514, Procedure I

5.5 GRMS, 5-2000Hz, 60 min/axis, 3 axes

MIL-STD-810, Shock, Method 516, Procedure I/V

20G, 11ms

Electromagnetic Compatibility Standards
IEC 61850-3
Emissions

Radiated FCC Part 15. 109, Class A; Conducted FCC Part 15. 107, Class A

Testing with solid state drives
Mechanical
Height
1.75" (4.45cm)
Width
16.5" (41.91cm)
Depth
11" (27.94cm) excluding connectors
Weight:
7.52 lbs ( 3.41 kgs ) Power: 55-80W with select configurations, CPU dependent
CPU
Internal Bays: One (1), two (2), or three (3) SATA 2.5" SSD (not externally removable)
Internal Expansion Slots
One PCIe X16 low profile
Cooling

Extended temperature range with forced convection (fan included), requires 1.5″ clearance front and rear for full thermal performance

Mounting
Option 1

Panel mounting via ears on base

Option 2

19″ rack mount kit

Power Supply
Option 1

90-250 VAC 50/60 Hz with locking power cord

Option 2

18-36 VDC

Option 3

48 VDC

Option 4

125VDC

System Board
(Note, these features are at the board level and may not all be available in the standard configuration)
Option 1

X9SPV-LN4F-3LE, FCBGA1023, i7-3555LE CPU, 2-16 GB ECC DDR3, 4-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Option 2

X9SPV-F-3217UE, FCBGA1023, i3- 3217UE CPU, 2-16 GB ECC DDR3, 2-USB 2.0, 2-GBLAN, On-board SATA2 & SATA3

Option 3

X9SPV-M4, FCBGA1023, i7-3555LE CPU, 2-16GB ECC DDR3, 2-USB 3.0, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Option 4

X9SPV-M4-3UE, FCBGA1023, i7-3517UE CPU, 2-16 GB ECC DDR3, 2-USB 3.0, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Option 5

X9SPV-LN4F-3QE, FCBGA1023, i7-3612QE CPU 2-16 GB ECC DDR3, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Option 6

X9SPV-F-3610ME, FCBGA1023, i5-3610ME CPU, 2-16 GB ECC DDR3, 2-USB 2.0, 2-GBLAN, On-board SATA2 & SATA3

Option 7

X9SPV-M4-3QE, FCBGA1023, i7-3612QE CPU, 2-16 GB ECC DDR3, 2-USB 3.0, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Software Compatibility
Accepts Windows 8®, Windows 7®, VMware®, RHEL 5® or RHEL 6®
Export Compliance
ECCN: 5A992 | Classification is dependent on configuration and is subject to change. Please contact your Business Development Manager to receive the classification of your product.

Deployments

This product is ideal for the following industrial applications:

 Power Generation & Distribution

Oil & Gas

Reports, Guides & Drawings

RE0813 Embedded Computer- Outline Installation Drawing
TST-00081 RE0813 November 2013 FCC Test Report
RE0813 Rugged Embedded Hardware Guide
TST-00111 RE0813 February 2014 Thermal In-House Test Report
TST-00191 RE0813 September 2014 MIL-STD-810 Thermal In-House Test Report
TST-00176 RE0813 August 2014 MIL-STD-810 Thermal In-House Test Report