Field tested, failsafe, and long life performance in extreme conditions. Feature rich Crystal Group Embedded Computer Systems are powerful, compact, and rugged. Completely and easily configurable, the Embedded product line boasts advanced thermal management, and are field-tested to withstand shock and vibration, extended temperature ranges, harsh elements and harsh environments. Crystal Group Embedded Computer Systems follow the Intel® Roadmap to ensure access to the latest, powerful Intel chipsets and processors.
- Light weight aluminum construction – 10 lbs. (4.5 kg)
- Tray or wall mounted
- Large thermostatically controlled fans for quiet operation
- MS 3476L12 military circular power connector
- Up to three 2.5” SSD removable drives
- Xeon D or Skylake CPU motherboard options
- Modular power supply for multiple input options
- One PCIe x16 expansion slot
- Ultra rugged and compact for extreme ambient conditions
Please contact us to receive the reports, guides and drawings that best fit your requirements.
-25°C to +60°C, with solid state drives
-55°C to +85°C
240 hours with humidity kit
12,500ft operation, 40,000ft transport
7.18GRMS x- and y-axis, 4.63GRMS z-axis, 5-2000Hz, 60 min/axis
20g, 11msec – functional shock; 40g, 11msec – crash hazard shock
Modulated speed, high volume thermostatically controlled fans, air over components
cooling design
120/240 VAC (300W) 50/60Hz, 115 VAC 400Hz, with MIL-STD-461 filtering,
MIL-STD-704
9-18VDC (144W) with MIL-STD-461 filtering, MIL-STD-704
18-36VDC (200W) with MIL-STD-461 filtering, MIL-STD-704
36-75VDC (200W) with MIL-STD-461 filtering, MIL-STD-704
LGA 1151, DP, HDMI, DVI-I, 2x 1G LAN, 1x PCI-E 3.0 x16; Multiple Processor options available; Maximum Memory: 32GB DDR4
FCBGA1667, VGA, IPMI, 2x 1G + 2x 10G LAN, 1x PCI-E 3.0 x16; Processors: XEON D-1528, 2.2GHz/2.6GHz; Maximum Memory: 128GB DDR4