RE1813 Rugged Embedded Computer

Field tested, failsafe, and long life performance in extreme conditions. Feature rich Crystal Group Embedded Computer Systems are powerful, compact, and rugged. Completely and easily configurable, the Embedded product line boasts advanced thermal management, and are field-tested to withstand shock and vibration, extended temperature ranges, harsh elements and harsh environments. Crystal Group Embedded Computer Systems follow the Intel® Roadmap to ensure access to the latest, powerful Intel chipsets and processors.

Features

  • Light weight aluminum construction –  10 lbs. (4.5 kg)
  • Tray or wall mounted
  • Large thermostatically controlled fans for quiet operation
  • MS 3476L12 military circular power connector
  • Up to three (3) 2.5” SSD removable drives
  • Xeon D or Skylake CPU motherboard options
  • Modular power supply for multiple input options
  • One PCIe x16 expansion slot
  • Ultra rugged and compact for extreme ambient conditions

Specifications

Environmental Standards
MIL-STD-810, Operational Temperature

-40°C to +60°C, with solid state drives

MIL-STD-810, Storage, Method 501, Procedure I/II

-55°C to +85°C

MIL-STD-810, Humidity, Method 507, Procedure II

240 hours with humidity kit

MIL-STD-810, Altitude, Method 500

12,500ft operation, 40,000ft transport

MIL-STD-810, Vibration, Method 514, Procedure I

7.18GRMS x- and y-axis, 4.63GRMS z-axis, 5-2000Hz, 60 min/axis

MIL-STD-810, Shock, Method 516, Procedures I/V

20g, 11msec – functional shock; 40g, 11msec – crash hazard shock

Electromagnetic Compatibility Standards
Some standards may require an internal kit
MIL-STD-461 CE102 (conducted) & RE102 (radiated) emissions, EMC
Emissions: radiated FCC Part 15. 109, Class A; conducted FCC Part 15. 107, Class A
Testing with solid state drives
Mechanical
Form Factor
1U
Height
3" (7.62cm)
Width
16.15" (41.02cm) with mounting; 14.9 (37.84 cm) without mounting
Depth
10.5" (26.67cm) excluding connectors, ground stud, or drive carrier protrusions
Weight:
10 lbs ( 4.54 kgs ) depends on card content (fully loaded)
Memory
32 GB DDR4 (motherboard dependent)
Cooling

Modulated speed, high volume thermostatically controlled fans, air over components
cooling design

Mounting
Fixed mount or tray mount
Power Supply
Option 1

120/240 VAC (300W) 50/60Hz, 115 VAC 400Hz, with MIL-STD-461 filtering,
MIL-STD-704

Option 2

9-18VDC (144W) with MIL-STD-461 filtering, MIL-STD-704

Option 3

18-36VDC (200W) with MIL-STD-461 filtering, MIL-STD-704

Option 4

36-75VDC (200W) with MIL-STD-461 filtering, MIL-STD-704

System Board
X11SSV-Q (default option)

LGA 1151, DP, HDMI, DVI-I, 2x 1G LAN, 1x PCI-E 3.0 x16; Processors: Quad core i7-6700/7700, 3.4GHz/4.0GHz,
HD530; Maximum Memory: 32GB DDR4

X10SDV-6C-TLN4F

FCBGA1667, VGA, IPMI, 2x 1G + 2x 10G LAN, 1x PCI-E 3.0 x16; Processors: XEON D-1528, 2.2GHz/2.6GHz; Maximum Memory: 128GB DDR4

Software Compatibility
Accepts Windows 10®, VMware®, Redhat 6.5®, Redhat 6.6® or Windows Server 2016®
Export Compliance
ECCN: 5A992; Classification is dependent on configuration and is subject to change. Please contact your Business Development Manager to receive the classification of your product.