RS2704L22 Rugged 2U Server

Take real-time AI & ML from the data center to the edge. Hosts two dual-width, full-height GPUs or FPGAs with the latest generation Intel® Xeon® Scalable or AMD EPYC™ processors in an unmatched rugged design, the RS270422 delivers exceptional reliability and Tensor Core performance at the tactical edge.  Designed to handle challenging, yet critical inference obstacles, the extreme, scalable compute power of the RS2704L22 brings ultra-low latency and seamless operation to the most volatile, mission-critical conditions when real-time situational awareness and AI can’t be compromised. InfiniBand I/O connectivity provides critical, rapid data transfer for low-latency backhaul applications.

This NVIDIA-Certified System is validated for optimal performance, manageability, security and scalability.

Use Cases:

  • Battlespace management awareness
  • Command and control communications
  • Intelligence gathering and processing
  • Data storage server
  • Sensor fusion for air and ground vehicles
  • Leader-follower autonomous vehicles
  • GPU server
  • Virtualization platform
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Crystal Group FG2 2600 Series: 2U servers
  • Single or dual processors
  • 22 cores
  • Up to 6 low-profile PCIe slots
  • 2 NVMe
  • 4 SATA
  • AC or DC power
  • 16GB-2TB or 32GB-4TB DDR4
  • Modular design

 

Mechanical
Form Factor 2U
Height 3.5” (8.9 cm)
Depth 22” (58.9 cm)
Width 17.5” (44.5 cm)
Weight 34-40 lbs. (15.4-18.1 kg)
Mounting
Delrin glides, fixed mount (front and rear), or Jonathan rails
Power Supply
1800WAC or 1620WDC
CPU Architecture
3rd Generation Intel Xeon Scalable
AMD EPYC 7003 series processors
Memory
16GB–4TB DDR4 ECC SDRAM (motherboard dependent)
Expansion
2x Full Height, Dual Width GPU/FPGA, 3x low profile PCIe slots
I/O
Commercial I/O or optional MIL-CIRC connector I/O
Software Compatibility
Windows 11, Windows Server, VMware, Linux
Environmental Standards
MIL-STD-810, Altitude, Method 500 12,500 ft. operation, 40,000 ft. transport
MIL-STD-810, Operational Temperature, high Procedure II: +35°C, two-hour dwell, four cycles
MIL-STD-810, Operational Temperature, low Procedure II: -40°C, two-hour dwell, four cycles
MIL-STD-810, Thermal Shock, Method 503 Procedure II: 10 cycles, -40°C to +55°C, 15-min dwell, <1-min transfer time
MIL-STD-810, Humidity, Method 507 Procedure II: 240 hours with optional conformal coating kit
MIL-STD-810, Fungus, Method 508 28 days, mixed spore, 30°C 95% RH
MIL-STD-810, Salt fog, Method 509 48-hour test
MIL-STD-810, Sand-Dust, Method 510 Procedure I: Blasting dust, 12 hours
MIL-STD-810, Acceleration, Method 513 Procedure II: 9g
MIL-STD-810, Vibration, Method 514 Procedure I: 4.7G, 5–2,000Hz, 60 min/axis, 3 axis
MIL-STD-810, Shock, Method 516 Procedures I & V: 40G, 11ms, 18 pulses, 3/axis both directions
MIL-STD-1474E, Acoustic Noise Requirement S, Grade A3
MIL-STD-167-1A, Ship Vibration Type 1
MIL-S-901E, Shipboard Shock Class II, A/B
Electromagnetic Compatibility Standards
MIL-STD-461 EMI/EMC, RE102, CE102; surface ship, below deck, and ground
RTCA/DO-160 Aircraft and airborne equipment, Category M
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