SE16 Sealed Embedded Computer

Field tested, failsafe and long life performance in extreme conditions. Feature rich Crystal Group Sealed Embedded Computer Systems are powerful, compact, and rugged. Completely and easily configurable, the Embedded product line boasts advanced thermal management and an all-aluminum
chassis, are field-tested to withstand shock and vibration, extended temperature ranges, harsh elements and harsh environments. Crystal Group Sealed Embedded Computer Systems follow the Intel® Roadmap to ensure access to the latest, powerful Intel chipsets and processors.

Features

• All aluminum construction – 23 lbs.
• Easily mounted from base or top
• Rugged sealed system rated to IP67
• Versatility with up to six (6) 2.5″ SSD hard drives
• Power efficient Intel Core i3® and Intel Core i7® options
• Natural convection cooled, does not require cold plate

Specifications

Environmental Standards
MIL-STD 810,Operational Temperature, Method 501, Procedure I/II

-40°C to +50°C, reduced performance to +71°C

MIL-STD-810, Storage, Method 501, Procedure I/II

-55°C to +85°C

MIL-STD-810, Humidity, Method 507, Procedure II

240 hours

MIL-STD-810, Altitude, Method 500

12,500ft operation, 40,000ft transport

MIL-S-901, Grade B, Class 2, Type B

Testing performed with SSD

MIL-STD-810, Vibration, Method 514, Procedure I

5.5G, 5-2,000Hz, 60 min/axis, 3 axes with vibration kit

Electromagnetic Compatibility Standards
Some standards may require an internal kit
DC, MIL-STD-461, RE102, CE102 compliant
Mechanical
Height
13.34" (33.88cm)
Width
3.7" (9.4cm) max
Depth
14.075" (35.75cm) max over handles & mil-circ connectors
Weight:
23 lbs ( 10.43 kgs ) max w/ all drives populated and one card installed
CPU
Intel® CPU architecture options from Intel embedded long-life roadmap
Option 1

Dual core i7-3555LE, X9SPV-LN4F-3LE & X9SPV-M4

Option 2

Dual core i3- 3217UE, X9SPV-F-3217UE

Option 3

Dual core i7-3517U, X9SPV-M4-3UE

Option 4

Quad core i7-3612QE, X9SPV-LN4F-3QE & X9SPV-M4-3QE

Option 5

6 core , X10SDV-6C

Internal Expansion Slots
One (1) PCIeX16 3/4 length 8.5” max full height
Removable Drives and I/O
Option 1

Six (6) removable 2.5″ drives

Option 2

Three (3) removable drives & a capacitance holdup module

Option 3

Rotational hard drives w/ vibration or temperature specifications

Option 4

Above options w/ easy access thumb screws for drive access door (not IP67 compliant)

Cooling

Natural convection, requires 1.5″ clearance (side to side) for full thermal performance

Mounting
Mounted from the base flanges with eight (8) 12-24 socket head machine screws
Power Supply
18-36VDC, MIL-STD-1275, MIL-STD-704, MIL-STD-461
System Board
Option 1

X9SPV-LN4F-3LE, FCBGA1023, i7-3555LE CPU, 2-16 GB ECC DDR3, 4-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Option 2

X9SPV-F-3217UE, FCBGA1023, i3- 3217UE CPU, 2-16 GB ECC DDR3, 2-USB 2.0, 2-GBLAN, On-board SATA2 & SATA3

Option 3

X9SPV-M4, FCBGA1023, i7-3555LE CPU, 2-16 GB ECC DDR3, 2-USB 3.0, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Option 4

X9SPV-M4-3UE, FCBGA1023, i7-3517UE CPU, 2-16 GB ECC DDR3, 2-USB 3.0, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Option 5

X9SPV-LN4F-3QE, FCBGA1023, i7-3612QE CPU 2-16 GB ECC DDR3, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

Option 6

X9SPV-M4-3QE, FCBGA1023, i7-3612QE CPU, 2-16 GB ECC DDR3, 2-USB 3.0, 2-USB 2.0, 4-GBLAN, On-board SATA2 & SATA3

option 7

X10SDV-6C

Software Compatibility
Accepts Windows 8®, Windows 7®, VMware® or Linux®
Export Compliance
ECCN: 5A992 | Classification is dependent on configuration and is subject to change. Please contact your Business Development Manager to receive the classification of your product.

Reports, Guides & Drawings

SE16 (formerly known as SS16) Sealed Server - Outline Installation Drawing
SE16 (formerly known as SS16) October 2012 MIL_STD 461 Electromagnetic Compatibility Record
SE16 (formerly known as SS16) June 2011 Environmental & Dynamics Test Report
SE16 (formerly known as the SS16) Hardware Guide
TST-00126 SE16 (formerly the SS11) May 2009 MIL-STD-810 Test Report
TST-00003 SE16 October 2013 Thermal In-House Test Report