RE1012 Rugged Embedded Computer

Field tested, failsafe and long life performance in extreme conditions. Feature rich Crystal Group Embedded Computer Systems are powerful, compact, and rugged. Completely and easily configurable, the Embedded product line boasts advanced thermal management and an all-aluminum chassis, are field-tested to withstand shock and vibration, extended temperature ranges, harsh elements and harsh environments. Crystal Group embedded computer systems follow the Intel® embedded roadmap to ensure access to the latest in long life, powerful Intel chipsets and processors.

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RE1012 - Spec Sheet

Features

RE1012 Rugged Embedded Computer

• Compact construction – 2.4”H x 16” x 11” footprint
• Panel or rack mounting options
• Six (6) core Xeon D-1528 CPU
• Dual 2.5″ SSD hard drives
• Billet construction from milled and strain hardened 6061-T6511 structural aircraft aluminum
• IEEE 1613 and IEC 61850-3 certification ready
• Fanless, no moving parts, high reliability

Please contact us to receive the reports, guides and drawings that best fit your requirements.

Specifications

Environmental Standards
MIL-STD-810, Operational Temperature

-40°C to +40°C

MIL-STD-810, Storage, Method 501, Procedure I/II

-40°C to +85°C

MIL-STD-810, Humidity, Method 507, Procedure II

240 hours with humidity kit

MIL-STD-810, Altitude, Method 500

12,500ft operation, 40,000ft transport

MIL-STD-810, Vibration, Method 514, Procedure I

5.5G, 10-2000Hz, 60 min/axis, 3 axes

MIL-STD-810, Shock, Method 516, Procedure I/V

20g, 11msec– functional shock; 40g 11msec crash hazard shock

MIL-S-901, Grade B
MIL-S-901, Grade A

With solid state drives + shock kits

Electromagnetic Compatibility Standards
Some standards may require an internal kit
IEC 61850-3

International Standard Communication Networks and Systems for Power Utility Automation (covers environment and EMC concerns)

IEEE 1613

Standard Environmental and Testing Requirements for Communications Networking Devices in Electric Power Substations

Emissions

radiated FCC Part 15. 109, Class A; conducted FCC Part 15. 107, Class A

Testing with solid state drives
Mechanical
Form Factor
1U
Height
2.4" (6.1cm)
Width
16" (40.64cm)
Depth
11" (27.94cm)
Weight:
7.52 lbs ( 3.41 kgs ) Power: 55-80W with select configurations, CPU dependent
Expansion Slots
One PCIe X16 low profile
Internal Expansion Slots
Two (2) SATA 2.5” SSD (not externally removable), one (1) M.2 internal SSD
Cooling

Fanless; passively cooled through heatpipe technology with no moving components

Mounting
Panel mounting via ears on base
19” rack mount kit
Power Supply
Option 1

90-250 VAC 50/60 Hz with locking power cord

Option 2

18-36 VDC

Option 3

48 VDC

Option 4

130 VDC

System Board
X10SDV-6C-TLN4F, Xeon D-1528 CPU, Up to 128 GB ECC DDR4, 2-USB 2.0, 2-GBLAN, IPMI, VGA, 1-PCIe x16 (Note, these features are at the board level and may not all be available in the standard configuration)
Software Compatibility
Accepts Windows 10®, RHEL® or VMware 6®
Export Compliance
ECCN: 5A992 | Classification is dependent on configuration and is subject to change. Please contact your Program Manager to receive the classification of your product.