Crystal Group FG2 1100 Series: 1U servers

The Crystal Group FG2 1100 Series servers provide enhanced storage and CPU options based on specific application needs. Intel’s® 3rd Gen Xeon® Scalable processors have built-in artificial intelligence (AI) acceleration with Intel® Deep Learning Boost, advanced encryption standard (AES), total memory encryption, software guard extensions (SGX), support a single- or dual-socket P+ FG2 motherboard, and increase system memory bandwidth with up to eight 3200MHz DDR4 channels.

Crystal Group FG2 1100 Series: 1U servers
  • Single or dual processors
  • 24 cores
  • 1 PCIe
  • Modular design
  • AC or DC power
  • 4TB RDIMM
Environmental Standards
MIL-STD-810, Operational Temperature, high Procedure II: +55°C, two-hour dwell, four cycles
MIL-STD-810, Operational Temperature, low Procedure II: -40°C, two-hour dwell, four cycles
MIL-STD-810, Altitude, Method 500 12,500 ft. operation, 40,000 ft. transport
MIL-STD-810, Thermal Shock, Method 503 Procedure II: 10 cycles, -40°C to +55°C, 15-min dwell, <1-min transfer time
MIL-STD-810, Humidity, Method 507 Procedure II: 240 hours with optional conformal coating kit
MIL-STD-810, Fungus, Method 508 28 days, mixed spore, 30°C 95% RH
MIL-STD-810, Salt fog, Method 509 48-hour test
MIL-STD-810, Sand-Dust, Method 510 Procedure I: Blasting dust, 12 hours
MIL-STD-810, Acceleration, Method 513 Procedure II: 9g
MIL-STD-810, Vibration, Method 514 Procedure I: 4.7G, 5–2,000Hz, 60 min/axis, 3 axis
MIL-STD-810, Shock, Method 516 Procedures I & V: 40G, 11ms, 18 pulses, 3/axis both directions
MIL-STD-1474E, Acoustic Noise Requirement S, Grade A3
MIL-STD-167-1A, Ship Vibration Type 1
MIL-S-901E, Shipboard Shock Class II, A/B
Electromagnetic Compatibility Standards
MIL-STD-461 EMI/EMC, RE102, CE102; surface ship, below deck, and ground
RTCA/DO-160 Aircraft and airborne equipment, Category M
Mechanical
Form Factor 1U
Height 1.75” (4.45 cm)
Depth 19” (48.3 cm) or 22” (55.9 cm)
Width 16.9” (44.5 cm)
Weight 23–26 lbs (10.4-11.8 kg) or 26–29 lbs (11.8-13.2 kg)
CPU
Gen3 Intel Xeon Scalable or AMD EPYC 7003 series processors
CPU Power: up to 165W per socket
Expansion Slots
One low-profile or full-height PCIe slot (motherboard dependent)
External Bays
Option 1 Up to four bays populated with FORCE module accessories
Option 2 Optical drive with up to two bays populated with FORCE module accessories
Memory
16GB–4TB DDR4 ECC RDIMM/LRDIMM (motherboard dependent)
Mounting
Glides, fixed mount (front and rear), or Jonathan rails
Power Supply
800WAC, 505W 18–36VDC
Software Compatibility
Windows 10, Windows Server, VMware, Linux, RedHat
Download Spec Sheet