Crystal Group FG2 3700 Series: 3U servers

Achieve an information superiority at the speed of relevance. Designed with up to four of the world’s highest-performing GPUs and either Intel® Xeon® Scalable or AMD EPYC™ processors with the latest PCIe Gen4 interconnectivity, the Crystal Group FG2 3700 Series servers deliver unmatched acceleration for data processing, machine learning, AI training, and AI inference. The scalable configuration can also accommodate ultra-fast DPUs. Pairing GPUs with DPUs enables enhanced data and application security, increased data center and cloud application performance, and ultra-low latency networking at the edge. The compact, rugged design integrates high-capacity, long-life, custom power supplies, and custom heat sinks for optimal thermal performance. This ensures reliable, seamless execution of mission-critical applications—from real-time sensor fusion and object recognition to video processing and ray tracing delivering complete, accurate, actionable intelligence.

This NVIDIA-Certified System is validated for optimal performance, manageability, security and scalability.

Crystal Group FG2 260000 Series: 1U servers
  • Single or dual processors
  • 64 cores
  • 7 PCIe
  • 2 M.2
  • 12 NVMe
  • 24 SATA
  • AC or DC power
  • 4TB DDR4
  • Modular design

Click here to view all Crystal Group FORCE Module Options.

Environmental Standards
MIL-STD-810, Operational Temperature, high Procedure II: +50°C, two-hour dwell, four cycles
MIL-STD-810, Operational Temperature, low Procedure II: -30°C, two-hour dwell, four cycles
MIL-STD-810, Altitude, Method 500 12,500 ft. operation, 40,000 ft. transport
MIL-STD-810, Thermal Shock, Method 503 Procedure II: 10 cycles, -40°C to +55°C, 15-min dwell, <1-min transfer time
MIL-STD-810, Humidity, Method 507 Procedure II: 240 hours with optional conformal coating kit
MIL-STD-810, Fungus, Method 508 28 days, mixed spore, 30°C 95% RH
MIL-STD-810, Salt fog, Method 509 48-hour test
MIL-STD-810, Sand-Dust, Method 510 Procedure I: Blasting dust, 12 hours
MIL-STD-810, Acceleration, Method 513 Procedure II: 9g
MIL-STD-810, Vibration, Method 514 Procedure I: 4.7G, 5–2,000Hz, 60 min/axis, 3 axis
MIL-STD-810, Shock, Method 516 Procedures I & V: 40G, 11ms, 18 pulses, 3/axis both directions
MIL-STD-1474E, Acoustic Noise Requirement S, Grade A3
MIL-STD-167-1A, Ship Vibration Type 1
MIL-S-901E, Shipboard Shock Class II, A/B
Electromagnetic Compatibility Standards
MIL-STD-461 EMI/EMC, RE102, CE102; surface ship, below deck, and ground
RTCA/DO-160 Aircraft and airborne equipment, Category M
Form Factor 3U
Height 5.25” (13.33 cm)
Depth 19” (48.3 cm) or 22” (58.88 cm)
Width 17.5” (44.45 cm)
Weight 38–42 lbs (17.23–19.05 kg) or 40–62 lbs (18.14–28.12 kg)
Gen3 Intel Xeon Scalable or AMD EPYC 7003 series processors
Up to 64 cores per socket (motherboard dependent)
Expansion Slots
Up to seven full-height PCIe slots
External Bays
Up to 12 bays populated with FORCE module accessories
Removable drive carrier: Up to 24 SATA or SAS SSDs
16GB–4TB DDR4 ECC SD RAM (motherboard dependent)
Glides, fixed mount (front and rear), or Jonathan rails
Power Supply
800WAC, 1005W 18–36VDC, or 1200W AC 1+1
Software Compatibility
Windows 10, Windows 11, Windows Server, VMware, Linux
Download Spec Sheet