RE1218M Rugged Embedded Computer

Field tested, failsafe and long life performance in extreme conditions. Feature rich Crystal Group Embedded Computer Systems are powerful, compact and rugged. Easily configurable, the embedded product line boasts advanced thermal management with a light carbon fiber chassis, and withstands extreme shock, vibration, extended temperature ranges, and harsh environments. Crystal Group embedded computer systems follow the Intel® Roadmap to ensure access to the latest, powerful Intel chipsets and processors.

Crystal Group designs in vital end-to-end security features from the start to meticulously integrate leading-edge rugged hardware Roots of Trust with encryption software from certified partners. With a foundation of essential features, including Trusted Performance Modules (TPM 2.0), FIPS 140-2 SAS solid state drives, intrusion detection, tamper evidence and instant data
destruction, we can protect your critical data from attempted breaches at the edge, when it matters most.

Features

RE1218M Rugged Embedded Computer

• Light weight aluminum construction – 15lbs. (6.8kg)
• Tray or wall mounted
• Thermostatically controlled fans for quiet operation
• MIL-C-26482 military circular I/O connectors
• Up to eight 2.5” SSD removable drives
• Intel® Xeon® D, or Skylake CPU
• Modular power supply for multiple input options
• One PCIe x16 expansion slot
• Ultra rugged compact for extreme ambient conditions

Please contact us to receive the reports, guides and drawings that best fit your requirements.

Specifications

Environmental Standards
MIL-STD-810, Operational Temperature

-40°C to +60°C, with solid state drives

MIL-STD-810, Storage, Method 501, Procedure I/II

-55°C to +85°C

MIL-STD-810, Humidity, Method 507, Procedure II

240 hours with humidity kit

MIL-STD-810, Altitude, Method 500

12,500ft operation, 40,000ft transport

MIL-STD-810, Vibration, Method 514, Procedure I

7.18GRMS x- and y-axis, 4.63GRMS z-axis, 5-2000Hz, 60 min/axis

MIL-STD-810, Shock, Method 516, Procedures I/V

20g, 11msec – functional shock; 40g, 11msec – crash hazard shock

Electromagnetic Compatibility Standards
Some standards may require an internal kit
MIL-STD-461 CE102 (conducted) & RE102 (radiated) emissions, EMC
Emissions

Radiated FCC Part 15. 109, Class A; conducted FCC Part 15. 107, Class A

Testing with solid state drives
Mechanical
Height
4.1" (10.41cm)
Width
10.25" (26.04cm)
Depth
14.4" (36.58cm) excluding connectors
Weight
14.5 lbs ( 6.58 kgs ) up to 16 lbs.; depends on card content (fully loaded)
CPU
Option 1, X11SSVQ**

Variable, various options

Option 2, X10SDV-6C-TLN4F

XEON D-1528, 2.2GHz/2.6GHz

Memory
- 128 GB DDR4
Option 1, X11SSVQ** - 32GB DDR4
Option 2, X10SDV-6C-TLN4F - 128GB DDR4
Cooling

High speed, high volume thermostatically controlled fans, air over components cooling design

Mounting
Fixed mount or tray mount
Power Supply
Option 1

9-18VDC (144W) with MIL-STD-461 filtering, MIL-STD-704

Option 2

18-36VDC (200W) with MIL-STD-461 filtering, MIL-STD-704

Option 3

36-75VDC (200W) with MIL-STD-461 filtering, MIL-STD-704

Option 4

120/240VAC (200W) 50/60Hz/115VAC 400Hz with MIL-STD-461 filtering, MIL-STD-704

System Board
Option 1, X11SSVQ**

LGA 1151, DP, HDMI, DVI-I, 2x 1G LAN, 1x PCI-E 3.0 x16

Option 2, X10SDV-6C-TLN4F

FCBGA1667, VGA, IPMI, 2x 1G + 2x 10G LAN, 1x PCI-E 3.0 x16

Software Compatibility
Accepts Windows 10®, VMware®, Linux®, Redhat 6.5®, Redhat 6.6® or Windows Server 2016®
Export Compliance
ECCN: 5A992.c | Classification is dependent on configuration and is subject to change. Please contact your Program Manager to receive the classification for your product.