RE1218M Rugged Embedded Computer

With a foundation of essential features, including Trusted Performance Modules (TPM 2.0), FIPS 140-2 SAS solid state drives, intrusion detection, tamper evidence and instant data destruction, we can protect your critical data from attempted breaches at the edge, when it matters most.

Field tested, combat proven and long-life performance in extreme conditions. Feature rich Crystal Group Embedded Computer Systems are powerful, compact and rugged. Easily configurable, the embedded product line boasts advanced thermal management with a light billet aluminum chassis, and withstands extreme shock, vibration, extended temperature ranges, and harsh environments. Crystal Group embedded computer systems follow the Intel® Roadmap to incorporate the latest chipset and scalable processing technologies. Crystal Group designs in vital security features from the start to meticulously integrate leading-edge rugged hardware Roots of Trust with encryption software from certified partners.

Get a Quote Request More Info Download Spec Sheet

RE1218M Rugged Embedded Computer

  • Light weight aluminum construction – 15lbs. (6.8kg)
  • Tray or wall mounted
  • Thermostatically controlled fans for quiet operation
  • MIL-C-26482 military circular I/O connectors
  • Up to eight 2.5” SSD removable drives
  • Intel® Xeon® Scalable Processors
  • Modular power supply for multiple input options
  • One PCIe x16 expansion slot
  • Ultra rugged compact for extreme ambient conditions
Environmental Standards
MIL-STD-810, Operational Temperature -40°C to +60°C, with solid state drives
MIL-STD-810, Storage, Method 501, Procedure I/II -55°C to +85°C
MIL-STD-810, Humidity, Method 507, Procedure II 240 hours with humidity kit
MIL-STD-810, Altitude, Method 500 12,500ft operation, 40,000ft transport
MIL-STD-810, Vibration, Method 514, Procedure I 7.18GRMS x- and y-axis, 4.63GRMS z-axis, 5-2000Hz, 60 min/axis
MIL-STD-810, Shock, Method 516, Procedures I/V 20g, 11msec – functional shock; 40g, 11msec – crash hazard shock
Electromagnetic Compatibility Standards
Some standards may require an internal kit
MIL-STD-461 CE102 (conducted) & RE102 (radiated) emissions, EMC
Emissions: Radiated FCC Part 15. 109, Class A; conducted FCC Part 15. 107, Class A
Testing with solid state drives
Mechanical
Height 4.1" (10.41cm)
Width 10.25" (26.04cm)
Depth 14.4" (36.58cm) excluding connectors
Weight 14.5 lbs ( 6.58 kgs ) up to 16 lbs.; depends on card content
CPU
Option 1, X11SSVQ Variable, various options
Option 2, X10SDV-6C-TLN4F XEON D-1528, 2.2GHz/2.6GHz
Memory
Up to 128 GB DDR4 (X11SSVQ- 32GB DDR4, X10SDV-6C-TLN4F - 128GB DDR4)
Cooling
High speed, high volume thermostatically controlled fans, air over components cooling design
Mounting
Fixed mount or tray mount
Power Supply
Option 1 9-18VDC (144W) with MIL-STD-461 filtering, MIL-STD-704
Option 2 18-36VDC (200W) with MIL-STD-461 filtering, MIL-STD-704
Option 3 36-75VDC (200W) with MIL-STD-461 filtering, MIL-STD-704
Option 4 120/240VAC (200W) 50/60Hz/115VAC 400Hz with MIL-STD-461 filtering, MIL-STD-704
System Board
Option 1, X11SSVQ LGA 1151, DP, HDMI, DVI-I, 2x 1G LAN, 1x PCI-E 3.0 x16
Option 2, X10SDV-6C-TLN4F FCBGA1667, VGA, IPMI, 2x 1G + 2x 10G LAN, 1x PCI-E 3.0 x16
Software Capability
Accepts Windows 10®, VMware®, Linux®, Redhat 6.5®, Redhat 6.6® or Windows Server 2016®
Export Compliance
ECCN: 5A992.c | Classification is dependent on configuration and is subject to change. Please contact your Program Manager to receive the classification for your product.
Download Spec Sheet