RE1312 Rugged Embedded Computer

More GPU power in a small package. Easily configurable to meet specific customer needs, the RE1312 boasts advanced thermal management in a lightweight, carbon fiber chassis field-tested to withstand shock and vibration, extended temperature ranges, and harsh environments. The RE1312 is powered by a mini-ITX motherboard, making it an ideal compute system for small, air-cooled applications that do not require a lot of I/O.

RE1312 Rugged Embedded Computer
  • Light weight composite construction – 4.5”H x 12” W x 9”D footprint (7-8 lbs)
  • Intel® Xeon® D and Core i7 CPU options
  • 18-36 VDC power
  • Up to 64GB unbuffered, non ECC DDR4 1.2V SO-DIMM
  • Two 15mm SSD or three 7mm SSD storage options, removable drives
Mechanical
Height 4.5" (11.43cm)
Width 12" (30.48cm)
Depth 9" (22.86cm) excluding connectors
Weight 7.52 lbs ( 3.41 kgs )
Power 55-80W with select configurations, CPU dependent
CPU Architecture
Intel® Xeon® D and Core i7 CPU options
Expansion Slots
One PCIe 3.0x16 low profile expansion bay
Cooling
Three high reliability 60mm fans
Internal Expansion Slots
Up to three SATA 2.5” SSD (externally removable)
Memory
Memory Up to 64GB unbuffered, non ECC DDR4 1.2V SO-DIMM or 128GB ECC DDR4 with Xeon D
Power Supply
18-36 VDC
Mounting
Tray or bulkhead mounted using ears supplied
Software Capability
Windows® 10, RHEL® 6.6/6.7/7/7.1, SUSE SLES® 11, Ubuntu® 16, or Centos® 7.1 VMware®
Environmental Standards
MIL-STD-810, Operational Temperature -40°C to +60°C
MIL-STD-810, Storage, Method 501, Procedure I/II -40°C to +85°C
MIL-STD-810, Humidity, Method 507, Procedure II 240 hours with humidity kit
MIL-STD-810, Altitude, Method 500 12,500ft operation, 40,000ft transport
MIL-STD-810, Vibration, Method 514, Procedure I 5.5GRMS, 5-2,000Hz, 60 min/axis, 3 axes with vibration kit
Electromagnetic Compatibility Standards
Some standards may require an internal kit
MIL-STD-461, CE102, RE102
Download Spec Sheet