Field tested, failsafe and long life performance in extreme conditions. Feature rich Crystal Group Embedded Computer Systems are powerful, compact, and rugged. Completely and easily configurable, the Embedded product line boasts advanced thermal management and a carbon fiber chassis, are field-tested to withstand shock and vibration, extended temperature ranges, harsh elements and harsh environments. Crystal Group Embedded Computer Systems follow the Intel® Roadmap to ensure access to the latest, powerful Intel chipsets and processors.
RE1312 Rugged Embedded Computer
- Light weight composite construction – 4.5”H x 12” W x 9”D footprint (7-8 lbs)
- Compact composite construction provides low SWaP
- Xeon®-D CPU technology
- Core i7 CPU options/ up to 16 cores Xeon-D
- 18-36 VDC power
- Up to 64GB unbuffered, non ECC DDR4 1.2V SO-DIMM or 128GB ECC DDR4 with Xeon-D offering
- Two 15mm SSD or three 7mm SSD storage options, removable drives
- MIL-STD-461 CE102, RE102 compliant
- Bulk head or tray mounted options
Environmental Standards
| MIL-STD-810, Operational Temperature | -40°C to +60°C |
| MIL-STD-810, Storage, Method 501, Procedure I/II | -40°C to +85°C |
| MIL-STD-810, Humidity, Method 507, Procedure II | 240 hours with humidity kit |
| MIL-STD-810, Altitude, Method 500 | 12,500ft operation, 40,000ft transport |
| MIL-STD-810, Vibration, Method 514, Procedure I | 5.5GRMS, 5-2,000Hz, 60 min/axis, 3 axes with vibration kit |
Electromagnetic Compatibility Standards
| Some standards may require an internal kit | |
| MIL-STD-461, CE102, RE102 |
Mechanical
| Height | 4.5" (11.43cm) |
| Width | 12" (30.48cm) |
| Depth | 9" (22.86cm) excluding connectors |
| Weight | 7.52 lbs ( 3.41 kgs ) |
| Power | 55-80W with select configurations, CPU dependent |
Expansion Slots
| One PCIe 3.0x16 low profile expansion bay |
Internal Expansion Slots
| Up to three SATA 2.5” SSD (externally removable) |
Cooling
| Three high reliability 60mm fans |
Mounting
| Tray or bulkhead mounted using ears supplied |
Power Supply
| 18-36 VDC | |
| (Other options under development) |
System Board
| Option 1 | X11SSV-Q, LGA 1151, Mini-ITX, H4 i7/i5/i3, DP, HDMI, DVI-I, 2X 1G LAN, 5X SATA3, 2X Serial, HD audio, 1X PCI-E 3.0 X 16, 6x USB 3.0 |
| Option 2 | X10SDV-6C-TLN4F, FCBGA 1667, Mini-ITX, Xeon-D 1528, 6 Cores, 2x 1GB LAN, 2x 10G LAN, 1x PCI-E 3.0 x 16 |
| Option 3 | Fujitsu/Kontron D3633-S,LGA1151, 8th/9th Gen Core i3/i5/i7/i9 series CPU, Q370 Chipset, up to 64GB via 2x DDR4 So-Dimm, 4x SATA, M.2, PCIe x16, 2x 1GbE, HD Audio, Intel HD Graphics via 1x DVI-D and 2X Display port, 4x USB 2.0, 4x USB 3.1, PS/2 K/M |
Software Capability
| Accepts Windows 10®, VMware®, RHEL 6.6®, RHEL 6.7®, RHEL 7®, RHEL 7.1®, SUSE SLES 11®, Centos 7.1®, Windows Server 2016® or Ubuntu 16® |